Materials Analyst, Microscopy

The Advanced Microscopy team is seeking a Materials Analyst to join our Dual Beam (SEM‑FIB) group in Raleigh, NC. This is a hands‑on, production‑focused role centered on TEM lamella preparation using Dual Beam FIB tools, supporting advanced materials and semiconductor analysis for clients across multiple industries.

The successful candidate will be a strong technical contributor who thrives in a fast‑paced lab environment, enjoys focused tool time, and values producing high‑quality, site‑specific results within defined client timelines.

• Preparing high‑quality, site‑specific TEM lamella using Dual Beam FIB‑SEM systems on novel materials and advanced semiconductor devices.
• Performing SEM imaging to support sample navigation, preparation, and quality verification.
• Managing multiple client samples, ensuring adherence to internal quality standards and turnaround commitments.
• Working closely with your team to optimize workflows, improve efficiency, and maintain consistent output.
• Collaborating with internal analytical teams and, as needed, clients to understand analysis requirements and standardized procedures.

This role is well‑suited for analysts who prefer focused tool time, hands‑on execution, and technical problem‑solving in a collaborative lab setting.

Work Schedule: Tuesdays to Saturdays, *5pm-2am (*10% evening shift differential will apply).

This position supports work related to defense applications and is subject to the highest level of ITAR (International Traffic in Arms Regulations). All considered applicants must be a U.S. Citizen.

• Bachelor’s or Master’s degree in Materials Science & Engineering or a related field, or equivalent industry experience. This position is designed for early- to mid-career professionals (BS/MS level) and is not aligned with PhD-level candidates.
• MUST HAVE hands‑on experience operating Dual Beam FIB‑SEM systems to independently execute sample preparation workflows.
• Working knowledge of electron microscopy principles (SEM/TEM).
• General understanding of semiconductor device physics and failure analysis concepts gained through coursework, lab work, or prior industry experience.
• Strong problem‑solving skills and the ability to manage priorities in a fast‑paced, deadline‑driven lab environment.

• Demonstrated expertise in TEM lamella preparation, including lift‑out and site‑specific techniques.
• Advanced SEM imaging experience.
• Prior experience supporting high‑throughput or production laboratory environments.
• Clear, timely technical communication with internal teams and external clients.

• Extensive, uninterrupted hands‑on tool time.
• Exposure to a wide range of advanced materials and semiconductor technologies.
• A collaborative team culture focused on technical excellence and continuous improvement.
• Evening shift structure that supports deep focus and accelerated technical mastery.

• Teamwork: Be inspired by your leaders, be encouraged by your teammates and be supported in all parts of your journey while you work with us.
• Learning & Development: Take on career development programs and goal setting to create big possibilities for your career and life. Develop within the company; be mentored and grown as a leader.
• Diversity & Authenticity: We work hard to embrace diversity and inclusion and encourage everyone to bring their authentic selves to work every day.

✓ Medical, Dental and Vision Coverage

✓ 401k Company Matching

✓ Paid Time Off

✓ Wellness Program

✓ Volunteer Time Off

✓ …and more!

Check out our other opportunities: www.eag.com/about/careers/