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Internship

Intern - Process Development Engineer, 3D DRAM Dry Etch

Micron Technology · Boise, ID

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About the Job

Our vision is to transform how the world uses information to enrich life for all.

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

At Micron, we are transforming how the world uses information to enrich life through innovative memory and storage solutions. The DRAM Dry Etch Process Development team develops advanced plasma etch technologies that enable future memory scaling, improved device performance, and next-generation semiconductor manufacturing. Our engineers work closely with integration, equipment, and process teams to solve complex challenges and accelerate technology development.

As a DRAM Dry Etch Process Development Intern, you will gain hands-on experience developing and optimizing advanced semiconductor etch processes that support future DRAM technologies. Working under the mentorship of experienced engineers, you will complete a technical project focused on process development, experimentation, and data analysis in a collaborative research and development environment. At the conclusion of the internship, you will present project results and recommendations to technical teams and leadership.

### Responsibilities

  • Research and develop innovative solutions that support next-generation memory technologies and advanced dry etch processes.
  • Design, implement, and analyze experiments to improve etch process performance, manufacturability, and product quality.
  • Perform statistical analysis of technology development and pilot manufacturing data to identify trends, process opportunities, and root causes.
  • Collaborate with process, equipment, and integration engineering teams to resolve technical challenges and drive process improvements.
  • Apply AI-enabled analysis tools, data-driven methodologies, or programming solutions to improve engineering efficiency and accelerate technical decision-making.

### Minimum Qualifications

  • Currently pursuing an M.S. or Ph.D. in Materials Science, Chemical Engineering, Electrical Engineering, Mechanical Engineering, Physics, Chemistry, or a related technical field.
  • Must be enrolled in an academic program throughout the internship period.
  • Knowledge of dry etch semiconductor processing, plasma physics, or related semiconductor fabrication technologies.
  • Experience with experimental design, data analysis, statistical methods, or engineering research projects.
  • Strong analytical, problem-solving, written, and verbal communication skills.

### Preferred Qualifications

  • Experience with semiconductor process development, process characterization, or advanced manufacturing environments.
  • Experience with programming, scripting, data analytics, or Leveraging AI to support engineering analysis and workflow optimization.
  • Familiarity with statistical analysis software, data visualization tools, Python, MATLAB, JMP, or similar platforms.
  • Experience conducting root-cause analysis, failure analysis, or process optimization projects.
  • Demonstrated ability to work independently, manage multiple priorities, and collaborate effectively within multi-functional teams.

Posted

3 days ago

Job Type

Internship

Location

  • Boise, ID