About the Job

Qorvo (Nasdaq: QRVO) supplies innovative semiconductor solutions that make a better world possible. We combine product and technology leadership, systems-level expertise and global manufacturing scale to quickly solve our customers' most complex technical challenges. Qorvo serves multiple high-growth segments of large global markets, including consumer electronics, smart home/IoT, automotive, EVs, battery-powered appliances, network infrastructure, healthcare and aerospace/defense. Visit www.qorvo.com to learn how our innovative team is helping connect, protect and power our planet.

Description

You will be a Principal Mechanical Design Engineer with Qorvo’s SSPA hardware engineering team, playing a pivotal role in the mechanical design and development of high-power microwave and millimeter-wave amplifiers, subsystems, and fully integrated LRUs, driving innovation, performance, and reliability across complex products and systems.

Your responsibilities will include

Partner closely with SSPA engineering disciplines, senior program leadership, production, and quality teams to drive successful outcomes.
Design high-performance electronics and RF systems, including ruggedized enclosures, RF subassemblies, PCBAs, harnesses, and cables.
Develop efficient thermal management solutions for high-power electronics, including liquid cold plates and advanced air-cooling strategies (fans, blowers, and ram-air).
Select and specify materials, components, and manufacturing processes to meet size, weight, power, cost, environmental, and schedule objectives.
Proactively identify and mitigate risks through rigorous analysis and well-defined verification testing.
Perform detailed thermal analysis, from system-level modeling to die/channel temperatures; structural FEA analysis including shock, vibration, and acceleration assessments.

Basic Qualifications

Bachelor of Science or Masters Degree in Mechanical Engineering or relevant discipline.
Minimum of 12 years experience in mechanical design of ruggedized electronics.
Demonstrated expertise in FEA-based thermal and structural analysis of electronics and electronics enclosures.
Strong background in technical data package development, including BOM creation, 2D drawings, and 3D modeling.
Working knowledge of GD&T (Geometric Dimensioning and Tolerancing).
Excellent written and verbal communication skills with the ability to collaborate effectively across teams.
Proficiency in Microsoft Office applications (Excel, Word, PowerPoint)..

Desired Qualifications

Experience designing electronics packaging for microwave and millimeter wave circuits, modules and antennas.
Experience with military and aerospace specifications: MIL-STD-810, MIL-STD-461, DO-160.
Experience with Solidworks, Flotherm CFD, Ansys Structures FEA.
Proven ability to manage multiple tasks and programs.

This position is not eligible for visa sponsorship by the Company.

This position requires a Security Clearance. Applicant must be a US Citizen and have the ability to obtain and maintain a US Government security clearance.